The Kaijo FB-x26BUMP1 is designed for high-speed bump bonding of silicon wafers. It provides thermo-sonic welding of balls from gold, copper or silver wires.
Wafer-level bonders make stud bumps onto silicon wafers and are mainly incorporated into the flip-chip package process. Kaijo offers two models of wafer bump bonders for different wafer sizes.
The Kaijo FB-x26BUMP2 is the most efficient automatic stud bump bonder delivering high productivity by handling wafers or substrates of up to 8 inches in diameter.