Ultrasonic Cleaning Systems

Wire Bonding Machines

For Demanding Industrial Applications

Benefit from more than 60 years of experience


Kaijo is a well-known manufacturer of ultrasonic cleaning technology and wire bonding machines since more than six decades. As a supplier of complete solutions for the semiconductor, hard disk, medical, vehicle and several other industries, our knowledge and experience have been appreciated by numerous customers worldwide.

Ultrasonic Cleaning

Ultrasonic Cleaning

Kaijo provides highly efficient ultrasonic cleaning systems and components for industrial purposes and has been a leader in developing new technologies to respond to the needs of the industrial market. The range includes turnkey systems, integrated systems, individual components as well as customized systems to meet specific requirements.

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Wire Bonding

Wire Bonding / Die Bonding

Kaijo wire and die bonding machines are equipped with cutting-edge technologies for the assembly process in semiconductor manufacturing.
They offer high-speed and fine-pitch bonding for high-mix, low-volume production, stable performance, high productivity and cost efficiency.

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