Die Bonders

Kaijo’s latest cost-effective die bonding systems combine basic chip mounting functions required for LED production with compactness and a unique mechanism.


The Kaijo DBX-1000 is an automated die bonder designed for the attachment of high-end epoxy dies with enhanced process features that enable highly efficient and cost-effective production.


The Kaijo eDB-2000 is fully automatic eutetic die bonder designed for the simultaneous attachment of sub-mounts and laser diodes.