![](https://kaijo-shibuya.de/wp-content/uploads/2019/10/wafer_2000x400_plain.jpg)
eDB-2000
Fully Automatic Eutectic Die Bonding System
Key Features
- Two bonding heads for simultaneous attachment of sub-mount and laser diode
- Small footprint
- Both bonding processes are performed in one chamber
Fully Automatic Eutectic Die Bonding System
Key Features