Thermo-Sonic Ball Bonders

Kaijo thermo-sonic ball bonders meet the requirements for a wide variety of packages such as lead frames, COB or hybrids. They are state-of-the-art for productivity, reliability and ease of use.


Der FB-e18 gehört zur neuesten Generation innovativer Ballbonder von Kaijo. Er wurde entwickelt, um alle Anforderungen an das Drahtbonden für eine Vielzahl von Anwendungen zu erfüllen, darunter diskrete Komponenten, LEDs und kleine Komponentengehäuse, bei denen entweder Gold-, Kupfer- oder Argentumlegierungsdraht zum Einsatz kommt.


The FB-988 is a sophisticated and fully automatic wire bonder. With an outstanding speed of 0.045 seconds per wire and a repeat accuracy of ±2 µm, the system is state of the art. A variety of components can be bonded thanks to the highly developed…


The Kaijo FB-996 is a reliable wire bonder designed for larger-sized packages. It can be used with either gold, copper or argentum wire and is also available as a model capable for wafer-level bonding (FB-996BUMP).


Fully automatic wire bonder (ball bonder) for TO-CAN packages


Fully automatic wire bonder (ball bonder) for COC/COS and TO-CAN packages