Fully Automatic Stud Bump Bonder

The Kaijo FB-x26BUMP3 is designed for high-speed bump bonding of silicon wafers up to 8 inches in diameter. It provides thermo-sonic welding of balls from gold, copper or silver wires  and offers a two-stage mechanism for a significant increase of productivity.

Key Features

  • 2 stages eliminates cooling time – the productivity can be significantly improved
  • High-speed bonding at 30 ms per bump
  • Ready for the growing demand of connectivity and Industry 4.0 SECS/GEM interface
  • Enhanced traceability and self-diagnosis functions
  • Working area for wafer sizes between 4" and 8" with optional WHS-996 unit
  • Compact transducer to minimize the effects of radiant heat
  • Bumping of heat-sensitive substrates (process temperature: 50 °C)
  • Automatic wafer feeding is available with a WHS-996 transport system (optional)

Optional WHS-996 transport system

Kaijo FB996BUMP2 with optional WHS-996

Wafers up to 8" can be used alone by manual transfer. Fully automatic transport is also available in combination with the optional WHS-996 transport system.