Kaijo thermo-sonic ball bonders combine advanced technology with ease of use and flexibility to deliver optimal solutions for a wide range of industrial or scientific applications.
Wire Bonding And Die Bonding Machines
Wafer-level bonders make stud bumps onto silicon wafers and are mainly incorporated into the flip-chip package process. Kaijo offers two models of wafer bump bonders for different wafer sizes.
Kaijo’s latest cost-effective die bonding systems combine basic chip mounting functions required for LED production with compactness and a unique mechanism.