Fully Automatic Thermo-Sonic Stud Bump Bonder

The FB-x26BUMP1 is designed for high-speed bump bonding of silicon wafers. It provides thermo-sonic welding of balls from gold, copper or silver wires.

Key Features

      • High-speed bonding at 30 ms per bump
      • Working area for wafer sizes between 4" and 6" with carrier
      • Compact transducer to minimize the effects of radiant heat
      • Ready for the growing demand of connectivity and Industry 4.0 thanks to SECS/GEM interface
      • Enhanced traceability and self-diagnosis functions
      • Bumping of heat-sensitive substrates (process temperature: 50 °C)