Fully Automatic Wire Bonder

The FB-i28 is a sophisticated and highly accurate automatic wire bonder. With an outstanding speed of 0.045 seconds per wire and a repeat accuracy of ±2 µm, the system is state of the art. A variety of components can be bonded thanks to the highly developed loop control. This ball bonder is ideal for fine-pitch and/or long-wire packages.

Key Features

  • Bonding area of 56 mm × 88 mm, working area up to 295 mm × 100 mm
  • α eyes – Kaijo’s improved recognition algorithm to avoid misalignment
  • Rigit and lightweight head design for highly accurate performance
  • Advanced servo and enhanced design of the Z arm with lower mass and higher stiffness
  • Enhanced non-stick detector for lower capacitance
  • Step Bond Sequence – visualized fine process control for enhanced bonding results
  • Ready for the demands of connectivity and Industry 4.0 thanks to SECS/GEM interface
  • Barcode reader can be optionally integrated
  • Automatic capillary cleaning
  • Automatic threading of the wire into a capillary