FB-x26BUMP1
The Kaijo FB-x26BUMP1 is designed for high-speed bump bonding of silicon wafers. It provides thermo-sonic welding of balls from gold, copper or silver wires.
Wafer-Level Bonders
Wafer-level bonders make stud bumps onto silicon wafers and are mainly incorporated into the flip-chip package process. Kaijo offers two models of wafer bump bonders for different wafer sizes.
FB-x26BUMP2
The Kaijo FB-x26BUMP2 is the most efficient automatic stud bump bonder delivering high productivity by handling wafers or substrates of up to 8 inches in diameter.
FB-x26BUMP3
The Kaijo FB-x26BUMP3 is designed for high-speed bump bonding of silicon wafers up to 8 inches in diameter. It provides thermo-sonic welding of balls from gold, copper or silver wires and offers a two-stage mechanism for a significant increase of productivity.
