Bonders

10 June 2021

Visit us at Productronica, 16–19 November 2021

Productronica describes itself as the “World’s Leading Trade Fair for Electronics Development and Production”. Visit us at this year’s exhibition from 16…

Read More…

8 June 2021

Kaijo Bonding Technology

Wire bonding using ultrasound energy is one of the most flexible techniques for making electrical connections in numerous fields. Kaijo also continues to take on the challenge of joining materials other than metals, as well as joining dissimilar metals….

Read More…

Kaijo eDB-2000 Die Bonder

eDB-2000

The Kaijo eDB-2000 is fully automatic eutetic die bonder designed for the simultaneous attachment of sub-mounts and laser diodes….

Read More…

Kaijo DBX-1000 Die Bonder

DBX-1000

The Kaijo DBX-1000 is an automated die bonder designed for the attachment of high-end epoxy dies with enhanced process features that enable highly efficient and cost-effective production….

Read More…

Die Bonders

Kaijo’s latest cost-effective die bonding systems combine basic chip mounting functions required for LED production with compactness and a unique mechanism….

Read More…

Kaijo FB-996BUMP1 Wafer-Level Thermo-Sonic Ball Bonder

FB-996BUMP2

The Kaijo FB-996BUMP2 is the most efficient automatic stud bump bonder delivering high productivity by handling wafers or substrates of up to 8 inches in diameter….

Read More…

Kaijo FB-996BUMP1 Wafer-Level Thermo-Sonic Ball Bonder

FB-996BUMP1

The Kaijo FB-996BUMP1 is a highly sophisticated and reliable automatic thermo-sonic stud bump bonder…

Read More…

Wafer-Level Bonders

Wafer-level bonders make stud bumps onto silicon wafers and are mainly incorporated into the flip-chip package process. Kaijo offers two models of wafer bump bonders for different wafer sizes….

Read More…

Kaijo FB-996 Thermo-sonic Ball Bonder

FB-e18LDW2

Fully automatic wire bonder (ball bonder) for COC/COS and TO-CAN packages…

Read More…

Kaijo FB-996 Thermo-sonic Ball Bonder

FB-e18LDW

Fully automatic wire bonder (ball bonder) for TO-CAN packages…

Read More…