The FB-e20N is part of the latest generation of Kaijo ball bonder innovations. It is designed to meet all wire bonding requirements for a variety of applications including discrete components, LEDs and small component packages using either gold, copper or argentum alloy wire….
The Kaijo FB-x26BUMP3 is designed for high-speed bump bonding of silicon wafers up to 8 inches in diameter. It provides thermo-sonic welding of balls from gold, copper or silver wires and offers a two-stage mechanism for a significant increase of productivity….
The Kaijo FB-i28 is a sophisticated and highly accurate automatic wire bonder. With an outstanding speed of 0.045 seconds per wire and a repeat accuracy of ±2 µm, the system is state of the art. A variety of components can be bonded thanks to the highly developed loop control. This ball bonder is ideal for fine-pitch and/or long-wire packages….
Wire bonding using ultrasound energy is one of the most flexible techniques for making electrical connections in numerous fields. Kaijo also continues to take on the challenge of joining materials other than metals, as well as joining dissimilar metals….