Bonders

8 June 2021

Wafer-Level Bonders

Wafer-level bonders make stud bumps onto silicon wafers and are mainly incorporated into the flip-chip package process. Kaijo offers two models of wafer bump bonders for different wafer sizes….

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Kaijo FB-e18 Thermo-sonic Ball Bonder

FB-e18LDW2

Fully automatic wire bonder (ball bonder) for COC/COS and TO-CAN packages…

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Kaijo FB-e18 Thermo-sonic Ball Bonder

FB-e18LDW

Fully automatic wire bonder (ball bonder) for TO-CAN packages…

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Thermo-Sonic Ball Bonders

Kaijo thermo-sonic ball bonders combine advanced technology with ease of use and flexibility to deliver optimal solutions for a wide range of industrial or scientific applications….

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5 September 2019

Wire Bonding And Die Bonding Machines

Kaijo wire and die bonding machines are equipped with cutting-edge technologies for the assembly process in semiconductor manufacturing….

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