Bonders
8 June 2021
Wafer-Level Bonders
Wafer-level bonders make stud bumps onto silicon wafers and are mainly incorporated into the flip-chip package process. Kaijo offers two models of wafer bump bonders for different wafer sizes….
Thermo-Sonic Ball Bonders
Kaijo thermo-sonic ball bonders combine advanced technology with ease of use and flexibility to deliver optimal solutions for a wide range of industrial or scientific applications….
5 September 2019
Wire Bonding And Die Bonding Machines
Kaijo wire and die bonding machines are equipped with cutting-edge technologies for the assembly process in semiconductor manufacturing….
