FB-x26

Fully Automatic Wire Bonder With Wider Area

The Kaijo FB-x26 is a reliable wire bonder designed for larger-sized packages requiring a bonding area of up to 95 mm. It can handle either gold, copper or argentum wire and is also available as a model capable for wafer-level bonding (FB-x26BUMP).

Key Features

• Wider bonding area of 56 mm × 95 mm, working area up to 295 mm × 105 mm
• α eyes – Kaijo’s improved recognition algorithm to avoid misalignment
• Advanced servo and enhanced design of the Z arm with lower mass and higher stiffness
• Robust and lightweight bonding head for high precision and low impact load
• Step Bond Sequence – visualized fine process control for enhanced bonding results
• High-speed touch detection function
• Ready for the demands of connectivity and Industry 4.0 thanks to SECS/GEM interface
• Barcode reader can be optionally integrated
• Automatic capillary cleaning
• Automatic threading of the wire into a capillary