Fully Automatic Thermo-Sonic Stud Bump Bonder

The FB-996BUMP1 is designed for high-speed bump bonding of silicon wafers. It provides thermo-sonic welding of balls from gold, copper or silver wires.

Key Features

      • 12 % higher productivity than the FB-996
      • High-speed bonding at 30 ms per bump
      • Working area for wafer sizes between 4" and 6" with carrier
      • Compact transducer to minimize the effects of radiant heat
      • Bumping of heat-sensitive substrates (process temperature: 50 °C)